Right, after it being mentioned that this stuff is superb for laptops (due to longetivity and the conveluted cooling arrangements at a guess) I tested it on an aspire 7100 I had lying around.
The heatsink between the CPU and chipset is linked on this, even thought the chipset half has it's own fins, the link can be seen easy by the influence of the CPU on the chipset temperature under load.
Anyhow, intial results on the standard paste/heatpad combo on the CPU/Chipset respectively, over a week of monitoring, averaged out at:
Load: 71*c (at which point it starts to downclock to reduce heat)
I then decided to try it with AS5 to give me a 'usual' baseline, again, averaged over a week, I applied it using my normal method with a plastic spreader, as over the years that's always given the best results for me personally.
Quite a nice drop really, especially as under load the CPU was no longer having to downclock (otherwise i think the stock setup would have gone another few degrees further.)
Anyway, on to the IC, I tried the plastic spreader method but it was immediately obvious that the compound is so dry that there was no way to 'wet' out the surface without trapping air from multiple passes, I could see it wasn't working, so reverted to the suggested 'bloody big blob' method.
The acer heatsinks are mounted on relatively soft springs and don't provide much in the way of pressure - in fact it barely squashed the paste down, never mind spread it - so I used a couple of plastic modelling clamps to apply 40lb of pressure directly above each die (no heatspreader here!), and left it for a few hours so the compound could creep.
I've literally just finished and put it back together, so I don't have average results at the minute, but the readings I've got over the past 30 minutes are:
Ambient: 21*c (oven's on)
It's interesting to note that with the linked heatsinks there's a huge drop in the influence of the CPU temperature on the chipset (probably due to the inverse square nature of heat transfer across the block), so I can see why they claim big benefits for laptops, that's probably a lot more life in the chipset given that kind of temperature drop.
Anyway, the AS5 looks fairly poor at the side of it - but I'm guessing the reason for that is the usual laptop problem of quite a large gap, especially on the chipset side, and generally thin/wavy patches in the heatsink for it to fill - it's fairly thin after all, especially compared to the thermal pad that was on there, and IC is thick enough to stick bricks together with, so probably did a better job of filling.
Anyway, enough rambling, verdict?
For the size of the tube, and the performance, I think I've found my new standard.
Next up, 4 core phenom desktop...